TechConnect Ventures
Sprint Challenge Brief:
Novel Materials to Enable High-Resolution 3D Printing of Complex Parts Sprint
Sprint Submissions Closed
Background
In collaboration with multiple global industrial partners, TechConnect Ventures is calling for Entries describing innovative materials, material enhancements and material engineering solutions to enable improved high-resolution additive manufacturing, 3D printing, 4D printing, and/or rapid prototyping that exceeds current standards. The goal of this enhanced resolution in the additive manufacturing process is to create parts (e.g. models, samples, components, spare parts, etc.) that do not require further post-processing or treatment such as machining or drilling. Materials that are applicable to any of the commercial additive manufacturing processes currently available (SLS, FFF, SLA, SLM, EBM) will be considered.
Requirements
Material innovations addressing any aspects of 3-D printing resolution will be considered including, but not limited to:
This call is open to all Entries that can address the structure and properties of these materials in all commercially available 3-D printing technologies including, but not limited to:
In addition to the criteria above, you are highly encouraged to highlight any additional material characteristics or performance properties that differentiate your technology including, but not limited to, low cost manufacturability and environmentally-friendly/sustainable materials and processes.
Business Opportunity for Solvers
All complete and eligible Entries will be included in an exclusive Innovation Opportunity Report that will be presented to our consortium of innovation-seeking clients and partners. Solvers with well-matched capabilities may be contacted directly by consortium members to discuss potential partnership opportunities. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.
Participation Rules & Guidelines
Solvers are encouraged to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.
QUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com